Good Price VS ZM Cell Phone Motherboard Repairing BGA Rework Station

Customer Show:

Where is it can be used ?

Main Feature of Cell Phone Repairing Station

Repair Success Rate:More Than 99%.

Using The Industrial Touch Screen.

Independent 3 Heating Zones, Hot Air Heating / Infrared Preheat. (temperature accuracy ± 3℃).

With CE Certification.

Techinal Parameter

What about Cell Phone Repairing Station introduction?

 1,The machine adopts touch screen man-machine interface, heating time, heating temperature, heating speed, cooling time, advance alarm, vacuum time and so on are all set inside the touch screen, the operation is intuitive, simple and easy to start;

2,The product red heating tube is heated by imported carbon fibre heating wire, heating fast and local temperature can be synchronized, PCB motherboard will not be deformed due to hot and cold temperature difference leading to poor welding, glass using German Schott microcrystalline glass, high temperature resistance 1200 ℃.

3,The machine is independently controlled by Panasonic PLC imported from Japan and Dalian Technology temperature control module, with real-time display of 7 temperature curves and 4 independent temperature measurement interfaces, which can be used for accurate temperature judgement for multiple points of the chip, thus ensuring the welding yield of the chip;

4,3temperature zones independent heating, each temperature zone can be set independently of the heating temperature, heating time, heating slope; 10 heating temperature segments, simulation of the 10 temperature zone reflow soldering heating mode, fully guarantee the welding effect of the BGA chip as well as the welding quality.

5,This machine is equipped with automatic feeding, sucking and discharging functions; it can automatically identify the centre position of the chip when aligning, and the alignment lens can be moved back and forth, left and right at any position when aligning, so as to prevent alignment dead ends;

6,multifunctional mode selection, there are 4 modes [welding, remove, mounting, semi-automatic], which can achieve automatic and semi-automatic functions to better meet the multiple needs of different products;

7,Choose the United States imported high-precision K-type thermocouple closed-loop control, and our unique heating method, to ensure that the welding temperature difference in ± 1 ℃.

8,The machine adopts imported optical alignment system, equipped with 15-inch high-definition display; choose high-precision micrometer for X/Y/R-axis adjustment; ensure the alignment accuracy control at 0.01mm.

9,In order to ensure the accuracy of the alignment, the upper heating head and mounting head integrated design; the machine is equipped with a variety of specifications BGA heating nozzle, to better meet the needs of customers of a variety of chips, heating nozzle easy to replace, special requirements can be customised.

10,High automation and precision, completely avoid human error; lead-free process and double-layer BGA, QFN, QFP, capacitors, resistors and other components rework can achieve the best results.