High Precision Original BGA Rework Station Laptop Motherboard Repair Machine Ps5 Bga Rework System
Where is it can be used for ?
1. For repairing Mobile phones
2. For repairing Notebooks/ Laptops/computers
3. For repairing game consoles, especially for XBOX360/PS3/WII
4. For repairing any other mainboards with size from 22x22mm to 470x390mm
5. For preheating chips or mainboards before soldering to improve rework efficiency.
Customer VisitHighlights of Ps5 Bga Rework System
1. USB interface.
2. 3 temperature zones
3. With more heating panel,more uniform heating
4. Hot sale model, praised by many customers.
5. Low cost laser position
6. Technical support is always available
7. Original Factory, look for worldwide distributors
Products Description:
1. Adopted with Linear slider, so all the three axles (X, Y, and Z) can do fine tuning and quick orientation with perfect positioning accuracy and speedily maneuverability.

2. Equipped with touch panel interface and PLC controlling to ensure it work stably and reliably. And it can storage multiple temperature profiling data of users. With password protection and modification function while power on. The temperature profiles will be displayed on the touch screen.

3. Three temperature zones to heat up independently, hot air heat up between up and down zones, IR heat in the bottom, temperature precise control is in±3℃.The upper temperature zone can be moved freely according to needs, the second zone can be adjusted up and down. The top and bottom heaters can be set several segments control at the same time. IR heating zone can be adjusted output power in the light of operation requirements.

4. The hot air nozzle can be rotated in 360 degree, the IR heater in the bottom can heat up the PCB board uniformly.

5. High accuracy K-type thermocouple closed-loop controlling. It can test temperature accurately through external temperature measurement interface, PCB board positioned by closed V-shape slot. The flexible and convenient universal jigs can prevent any damage or PCB deformation as well as it is suitable for all size of BGA package.

6. Large power fan to cool down the PCB quickly. The built-in vacuum pump and external vacuum nozzle is able to take BGA chips out easily.

7. Having alarm prompt function after welding is done, specially added early warning function for convenient operation.

8. It has Passed CE certificate.It is equipped with emergency stop switch and protection equipment to power off automatically when abnormal accident happened. Under this situation that temperature is out of control, circuit can automatically cut off the power with double over temperature protection function.

9. With the laser position and fast location the chip place.

Specification of Ps5 Bga Rework System

Packing & Delivery:

1, Standard Export Wooden cases for Ps5 Bga Rework System
2, Delivery in 2 workdays after payment confirm;
3, Shipping by TNT,DHL,FEDEX , or by air or by sea
4, Loading port: Shenzhen or Hongkong.

FAQ: