Hot Air Big Playstation2 Repair BGA Station for SMD BGA PLCC CHIP and QFP Components
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Why choose us?
1. We are the Manufacturer= own factory + machine design + Sheet metal produced by ourself + spray the powder + strong assemble the machine team + packaging + free training.
2. More than 11 years experiences in PCB BGA chips rework station, Over 20 R&D engineers.
3. Has been the biggest factory in the BGA rework field in China.
4. HUAWEI, TCL, ZTE, MEIZU, KONKA, LENOVO, FOXCONN vendor.
5. Over 100000 Global User.
6. Speedy and high quality customer service and whole-life after-sale service.
7. Deliver goods to customer all over the world with speed and precision.
Main Feature of Big Playstation2 Repair BGA Station:
Repair Success Rate:More Than 99%.
Using The Industrial Touch Screen.
Independent 3 Heating Zones, Hot Air Heating / Infrared Preheat. (temperature accuracy ± 3℃).
With CE Certification.
Big Playstation2 Repair BGA Station main features :
1 Integrated hot air nozzle and placement head design featuring automatic placement, automatic soldering, and automatic disassembly functions.
2 Utilizing a Panasonic PLC as the core control unit, integrated with Panasonic servo motors and Leisai stepper motor control, ensures more stable and reliable equipment operation.
3 Split-type alignment lens prevents thermal expansion and contraction issues caused by prolonged exposure to infrared preheating zones during equipment heating.
4 The gantry structure, in conjunction with the lead screw and servo motor, enables precise, efficient, and stable rapid and slow movements of the upper and lower heating heads in all directions.
5 CNC automatic operation mode: A single device startup can remove up to 6 faulty chips, ensuring high efficiency and speed.
6 Top-mounted hot air rework system with oversized air outlet, capable of handling 99.99% of chip desoldering and rework applications on the market.
7 The bottom heating head utilizes gas heating, employing either nitrogen or compressed air as the gas source to heat the PCB motherboard, thereby significantly improving chip soldering yield rates.
8 The infrared preheating zone utilizes imported carbon fiber heating tubes for rapid temperature rise, enabling swift heating around the PCB motherboard. This reduces temperature differentials between the BGA and surrounding areas, minimizing PCB deformation and improving soldering yield. Preheating zone dimensions: 600 × 510 mm effective area.
9 The lower heating head features motorized vertical adjustment with configurable parameters, which are saved alongside the temperature profile. The second heating zone includes PCB support screws to prevent PCB warping during heating, thereby avoiding soldering defects.
10 The upper and lower heating zones achieve synchronized automatic movement, enabling automatic positioning to any location within the bottom infrared preheating zone. This allows the PCB to remain stationary on the fixture while the upper and lower heating heads move as a single unit to the target chip on the PCB, ensuring comprehensive preheating of the entire PCB motherboard.
11 Dual joystick control, alignment lens, and upper/lower heating platforms ensure positioning accuracy.
12 The R-axis of the equipment is adjusted using a miniature precision motor, offering greater convenience and speed.
13 The nozzle automatically detects pick-up and placement height, with pressure controllable within a 10-gram range. It features zero-pressure pick-up and placement capabilities, specifically designed for smaller chips.
14 The color optical vision system features manual X and Y axis movement, with dichroic dual-color, magnification, and fine-tuning capabilities. It includes a chromatic aberration detection device, auto-focus functionality, and software operation, supporting repair of BGAs up to 90 x 90 mm in size.
15 Multiple sizes of alloy hot air nozzles, easy to replace, with 360° rotation for precise positioning.
16 Equipped with 5 temperature measurement ports, featuring multi-point real-time temperature monitoring and analysis capabilities.
17 This machine features a 10-inch high-definition industrial touchscreen with an oversized true-color interface for simple and convenient operation.
18 Equipped with a 19-inch high-definition industrial display, enabling faster and more precise chip alignment.
19 The material loading and unloading device is equipped with material detection functionality.
Big Playstation2 Repair BGA Station Specification :
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Total Power |
8000W |
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Upper heating power |
1200W |
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Bottom heating power |
1200W |
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IR Heating Power |
4800W（3200W controlled） |
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Power Supply |
Two Phases 220V、50/60Hz |
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Positioning Method |
V-shaped slots secure the PCB in place, laser positioning lights enable rapid alignment, and the joystick controls the motor for free movement along the X and Y axes. |
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Number of drive motors and control zones |
7 axes (X/Y-axis movement of the side-control device heating head, X/Y-axis movement of the alignment lens, Z1 electric lift of the second temperature zone heating head, Z-axis vertical movement of the upper heating head, and R-axis electric rotation). |
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Temperature Control |
High-precision K-type thermocouple (Ksensor) with closed-loop control, featuring independent upper and lower temperature measurement. Temperature control accuracy achieves ±1°C. |
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Electrical Material Selection |
Touchscreen + Dalian University of Technology temperature control module + Panasonic PLC + Panasonic servo + Panasonic photoelectric sensor + Leisai stepper driver, featuring top-tier brands from both domestic and international markets. |
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Max PCB size |
650*610mm(Effective coverage area, no blind spots for touch-ups） |
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Min PCB size |
10*10mm |
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Number of temperature measurement interfaces |
5pcs |
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Chip scaling range |
2-50times |
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PCB thickness |
0.5~8mm |
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Applicable chips |
0.8*0.8~90*90mm |
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Minimum Chip Pitch |
0.15mm |
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Maximum Placement Load |
800g |
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Mounting accuracy |
±0.01mm |
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Machine Dimensions |
L995*W851*H1015mm（not include monitor or stand; requires 500mm clearance for movement in front and rear.） |
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Machine weight |
About 170KG |
Packing & Delivery:
1, Standard Export Wooden cases for Big Playstation2 Repair BGA Station
2, Delivery in 2 workdays after payment confirm;
3, Shipping by TNT,DHL,FEDEX , or by air or by sea
4, Loading port: Shenzhen or Hongkong.
FAQ:
