multifunctional automatic mobile phone motherboard chipset repair machine factory in china

multifunctional automatic mobile phone motherboard chipset repair machine factory in china
Where is mobile phone motherboard chipset repair machine can be used for ?
1. For repairing Mobile phones
2. For repairing Notebooks/ Laptops/computers
3. For repairing game consoles, especially for XBOX360/PS3/WII
4. For repairing any other mainboards with size from 22x22mm to 460x380mm
5. For preheating chips or mainboards before soldering to improve rework efficiency.

Detial Picture
Highlights of mobile phone motherboard chipset repair machine:
1. USB interface.
2. 3 sensor port
3. With more heating panel,more uniform heating
4. Hot sale model, praised by many customers.
5. Low cost laser position
6. Technical support is always available
7. Original Factory, look for worldwide distributors
8. Optical HD CCD move freely


mobile phone motherboard chipset repair machine introduction:

Upper and lower temperature zone both are hot air heating, IR preheating zone for bright infrared heating, the temperature is accurately controlled at ± 2 ℃, the upper and lower temperature zone can be heated from the top of the components and the bottom of the PCB at the same time, meanwhile can be set up to 8 temperature control, so that the PCB board is heated uniformly, the bottom are the large IR preheating, so that the entire PCB temperature, to prevent deformation, to ensure that the welding effect, the heating plate can be independently controlled by the heating。

BGA chips and PCB boards can be hot air local heating at the same time, supplemented by a large area of infrared heaters on the bottom of the PCB board for preheating, can completely avoid the deformation of the PCB board in the rework process; through the selection of the upper temperature zone can be used individually or the lower temperature zone, and the free combination of upper and lower heaters Energy.

Select high-precision K-type thermocouple closed-loop control and PID parameter self-tuning system; can simultaneously display four temperature curves and store multiple sets of user data, and has an instantaneous curve analysis function; external temperature measurement interface to achieve precision detection of the temperature, can be analyzed and calibrated at any time on the actual acquisition of the BGA temperature curve. It can also analyze, set and correct the curve of temperature parameters on the touch screen at any time.

Adopting high-definition touch screen man-machine interface, upper heating device and mounting head integrated design. Equipped with a variety of specifications of titanium alloy BGA nozzle, the nozzle can be rotated 360 ° arbitrary, easy to install and replacement

The X and Y axes and the R angle are fine-tuned using micrometers for precise alignment and accuracy up to±0.01mm

With 4 operating modes，Four modes: remove, weld, mounting, semi-auto

Percentage air speed adjustment, fan speed and chip temperature profile saved at the same time

Slide rails drive the upper heating head, more precision

mobile phone motherboard chipset repair machine technical parameters:

Why choose us?
1. We are the Manufacturer= own factory + machine design + Sheet metal produced by ourself + spray the powder + strong assemble the machine team + packaging + free training.
2. More than 11 years experiences in PCB BGA chips rework station, Over 20 R&D engineers.
3. Has been the biggest factory in the BGA rework field in China.
4. HUAWEI, TCL, ZTE, MEIZU, KONKA, LENOVO, FOXCONN vendor.
5. Over 100000 Global User.
6. Speedy and high quality customer service and whole-life after-sale service.
7. Deliver goods to customer all over the world with speed and precision.

Want to know other model for mobile phone motherboard chipset repair machine?pls click the picture.