new bga vga repair machine for laptop motherboard chip good price

Customers Show:

Why choose us?
1. We are the Manufacturer= own factory + machine design + Sheet metal produced by ourself + spray the powder + strong assemble the machine team + packaging + free training.
2. More than 11 years experiences in PCB BGA chips rework station, Over 20 R&D engineers.
3. Has been the biggest factory in the BGA rework field in China.
4. HUAWEI, TCL, ZTE, MEIZU, KONKA, LENOVO, FOXCONN vendor.

5. Over 100000 Global User.
6. Speedy and high quality customer service and whole-life after-sale service.
7. Deliver goods to customer all over the world with speed and precision.

Main Feature of bga vga repair machine:

Repair Success Rate:More Than 99%.

Using The Industrial Touch Screen.

Independent 3 Heating Zones, Hot Air Heating / Infrared Preheat. (temperature accuracy ± 3℃).

With CE Certification.

Specification :

♦ Independent three-temperature zone temperature control system:

1) Upper and lower temperature zone both are hot air heating, IR preheating zone for infrared heating, the temperature is accurately controlled at ± 2 ℃, the upper and lower temperature zone can be heated from the top of the components and the bottom of the PCB at the same time, meanwhileareare can be set up to 8 temperature control, so that the PCB board is heated uniformly, the bottom are the large IR preheating, so that the entire PCB temperature, to prevent deformation, to ensure that the welding effect, the heating plate can be independently controlled by the heating.

2) BGA chips and PCB boards can be hot air local heating at the same time, supplemented by a large area of infrared heaters on the bottom of the PCB board for preheating, can completely avoid the deformation of the PCB board in the rework process; through the selection of the upper temperature zone can be used individually or the lower temperature zone, and the free combination of upper and lower heaters Energy.

3) Select high-precision K-type thermocouple closed-loop control and PID parameter self-tuning system; can simultaneously display four temperature curves and store multiple sets of user data, and has an instantaneous curve analysis function; external temperature measurement interface to achieve precision detection of the temperature, can be analyzed and calibrated at any time on the actual acquisition of the BGA temperature curve. It can also analyze, set and correct the curve of temperature parameters on the touch screen at any time.;

♦ Precise Optical Alignment System:

Adopting high-definition adjustable CCD color optical vision alignment system with beam splitting, zoom-in, zoom-out, and auto focus functions, and equipped with automatic chromatic aberration resolution and brightness adjustment device, which can adjust the clarity of the image; equipped with a 15” high-definition LCD monitor.

♦ Versatile and user-friendly operating system:

1) Adopting high-definition touch screen man-machine interface, upper heating device and mounting head integrated design. Equipped with a variety of specifications of titanium alloy BGA nozzle, the nozzle can be rotated 360 ° arbitrary, easy to install and replacement.

2) The X and Y axes and the R angle are fine-tuned using micrometers for precise alignment and accuracy up to±0.01mm.

♦ Superior Features:

1) With 4 operating modes,Four modes: remove, weld, mounting, semi-auto.

2) Percentage air speed adjustment, fan speed and chip temperature profile saved at the same time.

3) Slide rails drive the upper heating head, more precision.

Where is it can be used for ?